Different types of dislocation bundles were identified in thermally processed (001) GaAs wafers. Synchrotron based single crystal X-ray transmission topography, scanning infrared polariscopy, visible light interferometry, standard Nomarski microscopy, and Makyoh topography had been applied for this purpose and allowed for a classification of the dislocation bundles into one distinct majority and a generic minority type. The currently accepted theories are briefly discussed and it is shown that their disagreement with the core of the experimental observations is due to oversimplifications. A new theory is finally presented in a concise manner and its excellent agreement with all of the available experimental evidence is demonstrated.

Keywords: GaAs, dislocations, thermal treatment, plastic deformation

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