| Crystal Research and Technology |
| Keywords | thin films, resistivity, temperature coefficient of resistance, reflection coefficient, grain boundary, transmission coefficient, reflectivity |
| PACS | 68.55.Nq |
| DOI | 10.1002/crat.200510605 |
In this work it is experimentally investigated a size effect in temperature coefficient of resistance (TCR) of Ni films with Cu and SiO2 thin overlayer. The parameters of electrical transfer (the mean-free path of electron, the reflectivity coefficient of the external surfaces, the reflection and transmission coefficients at the grain boundary) were calculations. Decreasing of the value of the reflectivity coefficient is due to the change of the surface microrelief. It is show that the value of TCR decreases caused by the conditions of scattering changes on internal and external boundaries.

