The eutectic alloy Sn-9Zn was considered as a potential alternative to lead-tin solder alloys when compared with other solders. In this paper, ternary, quaternary and penternary additions of the elements Bi, Cu and In were added to the eutectic alloy as a trial to improve its properties. The results showed that, the penternary alloy has properties superior to those of the binary, ternary and quaternary alloys. The alloy of composition Sn-9Zn-1Bi-2Cu-2In has the most suitable properties as a candidate alloy for lead-free solder. It has a lower melting point, 186°C, which is very close to that of Sn-37Pb solder, a lower value of electrical resistivity, compared with that of Sn-37Pb, higher value of the Young’s modulus, 47 GPa, compared with 45 GPa of Sn-37Pb and a higher value of the Vickers hardness, 191 MPa, compared with 129 MPa of Sn-37Pb eutectic alloy.

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